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Lead the development and
implementation of flipchip, wirebonding, and SMT assembly processes to meet
quality, cost, and delivery targets.
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Collaborate with
cross-functional teams to drive new product development and resolve
assembly-related issues.
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Conduct process optimization
studies to improve yield, efficiency, and reliability.
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Provide technical expertise and
guidance on assembly processes.
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Maintain documentation,
including work instructions and process specifications.
Location: Leuven
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Candidate
Description
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- Bachelor's degree in
Mechanical Engineering, Electrical Engineering, or related field
(Advanced degree preferred).
- Minimum 5 years of
experience in assembly engineering, focusing on flipchip, wirebonding,
and SMT processes.
- Proficiency in using
assembly equipment such as wire bonders, flipchip bonders, and SMT
placement machines.
- Strong understanding
of assembly materials, including solder, adhesives, and underfills.
- Experience with
statistical analysis tools and methodologies for process optimization.
- Excellent
problem-solving skills and ability to troubleshoot complex assembly
issues.
- Hands-on experience
in flipchip, wirebonding, and SMT assembly processes.
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